🌍✨ Webinar: Driving the future of next-generation high-voltage power electronics
Why we’re watching: The transition toward 800V+ architectures, SiC/GaN MOSFETs, and highly integrated power conversion systems (x-in-1) is accelerating, creating new challenges for automotive electronic design.
In this webinar, Francesca Lai and Ann Park will share insights into evolving component design, emerging application requirements, and the role of adhesive solutions in enabling next-generation automotive power electronics components. 💚
What you’ll learn: Current market trends reshaping automotive power electronics design Emerging material requirements driven by 800V+ architectures, SiC/GaN adoption, and increasing system integration How Henkel´s solutions for thermal management, dielec…
⚡ Why this matters
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🔭 What to watch next
- 📌 Key signal: The transition toward 800V+ architectures, SiC/GaN MOSFETs, and highly integrated power conversion systems (x-in-1) is accelerating, creating new challenges for automotive electronic…
- ✅ Watch for measurable follow-through, not just announcements.
- 🔎 Share the most practical takeaway with your community.
🌱 Progress is real — let’s keep building it.
Truth. Solutions. Action. 🤝
Reporting curated for GreenTV. Original reporting via Charged EVs.